JAN1N983BUR-1
vs
1N983BUR-1E3
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROSEMI CORP
Package Description
HERMETIC SEALED, GLASS, LL34, MELF-2
O-LELF-R2
Reach Compliance Code
compliant
compliant
Factory Lead Time
20 Weeks
Additional Feature
METALLURGICALLY BONDED
METALLURGICALLY BONDED
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JEDEC-95 Code
DO-213AA
DO-213AA
JESD-30 Code
O-LELF-R2
O-LELF-R2
JESD-609 Code
e0
Moisture Sensitivity Level
1
Number of Elements
1
1
Number of Terminals
2
2
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
0.5 W
Qualification Status
Qualified
Reference Standard
MIL-19500/117
Reference Voltage-Nom
82 V
82 V
Surface Mount
YES
YES
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
PURE MATTE TIN
Terminal Form
WRAP AROUND
WRAP AROUND
Terminal Position
END
END
Voltage Tol-Max
5%
5%
Working Test Current
1.5 mA
1.5 mA
Base Number Matches
1
1
ECCN Code
EAR99
HTS Code
8541.10.00.50
Dynamic Impedance-Max
330 Ω
Operating Temperature-Max
175 °C
Compare JAN1N983BUR-1 with alternatives
Compare 1N983BUR-1E3 with alternatives