JAN1N974B
vs
1N975B-1
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
MICROSEMI CORP
MICROCHIP TECHNOLOGY INC
Part Package Code
DO-35
Package Description
O-LALF-W2
DO-35, 2 PIN
Pin Count
2
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
HTS Code
8541.10.00.50
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JEDEC-95 Code
DO-204AH
DO-204AH
JESD-30 Code
O-LALF-W2
O-LALF-W2
JESD-609 Code
e0
e0
Number of Elements
1
1
Number of Terminals
2
2
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.48 W
0.4 W
Qualification Status
Not Qualified
Not Qualified
Reference Standard
MIL-19500/117
Reference Voltage-Nom
36 V
39 V
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Voltage Tol-Max
5%
5%
Working Test Current
3.4 mA
3.2 mA
Base Number Matches
4
9
Factory Lead Time
14 Weeks
Additional Feature
METALLURGICALLY BONDED
Dynamic Impedance-Max
80 Ω
Knee Impedance-Max
1000 Ω
Operating Temperature-Max
175 °C
Operating Temperature-Min
-65 °C
Reverse Current-Max
0.5 µA
Reverse Test Voltage
30 V
Voltage Temp Coeff-Max
36.66 mV/°C
Compare JAN1N974B with alternatives
Compare 1N975B-1 with alternatives