JAN1N973B
vs
1N973BTR
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
BKC SEMICONDUCTORS INC
MICROCHIP TECHNOLOGY INC
Package Description
HERMETIC SEALED, GLASS, DO-35, 2 PIN
Reach Compliance Code
unknown
compliant
Additional Feature
METALLURGICALLY BONDED
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
58 Ω
58 Ω
JEDEC-95 Code
DO-204AH
DO-204AA
JESD-30 Code
O-LALF-W2
O-LALF-W2
JESD-609 Code
e0
e0
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
175 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.48 W
0.5 W
Qualification Status
Not Qualified
Reference Standard
MIL-19500/117
MIL-STD-750
Reference Voltage-Nom
33 V
33 V
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Voltage Tol-Max
5%
5%
Working Test Current
3.8 mA
3.8 mA
Base Number Matches
6
4
ECCN Code
EAR99
HTS Code
8541.10.00.50
Knee Impedance-Max
1000 Ω
Operating Temperature-Min
-65 °C
Reverse Current-Max
5 µA
Reverse Test Voltage
25.1 V
Voltage Temp Coeff-Max
30.36 mV/°C
Compare JAN1N973B with alternatives
Compare 1N973BTR with alternatives