JAN1N971B vs 1N971B-AP feature comparison

JAN1N971B Cobham Semiconductor Solutions

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1N971B-AP Micro Commercial Components

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer AEROFLEX/METELICS INC MICRO COMMERCIAL COMPONENTS
Part Package Code DO-35 DO-35
Package Description O-LALF-W2 ROHS COMPLIANT, GLASS PACKAGE-2
Pin Count 2 2
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code DO-35 DO-35
JESD-30 Code O-LALF-W2 O-LALF-W2
JESD-609 Code e0 e3
Number of Elements 1 1
Number of Terminals 2 2
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.5 W 0.5 W
Qualification Status Not Qualified Not Qualified
Reference Standard MIL-19500/117
Reference Voltage-Nom 27 V 27 V
Surface Mount NO NO
Technology ZENER ZENER
Terminal Finish TIN LEAD MATTE TIN
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Voltage Tol-Max 5% 5%
Working Test Current 4.6 mA 4.6 mA
Base Number Matches 6 1
Pbfree Code Yes
Rohs Code Yes
Moisture Sensitivity Level 1
Operating Temperature-Max 200 °C
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 10

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