JAN1N966C-1
vs
JAN1N968C-1
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
AEROFLEX/METELICS INC
MICROCHIP TECHNOLOGY INC
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
HTS Code
8541.10.00.50
Additional Feature
METALLURGICALLY BONDED
METALLURGICALLY BONDED
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JEDEC-95 Code
DO-204AH
DO-204AH
JESD-30 Code
O-LALF-W2
O-LALF-W2
Number of Elements
1
1
Number of Terminals
2
2
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.48 W
0.4 W
Qualification Status
Not Qualified
Qualified
Reference Voltage-Nom
16 V
20 V
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Voltage Tol-Max
2%
2%
Working Test Current
7.8 mA
6.2 mA
Base Number Matches
1
2
Rohs Code
Package Description
DO-35, 2 PIN
Factory Lead Time
20 Weeks
Dynamic Impedance-Max
25 Ω
JESD-609 Code
e0
Knee Impedance-Max
750 Ω
Moisture Sensitivity Level
1
Operating Temperature-Max
175 °C
Operating Temperature-Min
-65 °C
Reference Standard
MIL-19500
Reverse Current-Max
0.5 µA
Reverse Test Voltage
15 V
Terminal Finish
TIN LEAD
Voltage Temp Coeff-Max
17.2 mV/°C
Compare JAN1N966C-1 with alternatives
Compare JAN1N968C-1 with alternatives