JAN1N944B-1
vs
JAN1N944B
feature comparison
All Stats
Differences Only
Rohs Code
No
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MOTOROLA INC
Reach Compliance Code
compliant
unknown
Additional Feature
METALLURGICALLY BONDED
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JEDEC-95 Code
DO-35
DO-204AA
JESD-30 Code
O-LALF-W2
O-LALF-W2
JESD-609 Code
e0
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
175 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Power Dissipation-Max
0.5 W
0.5 W
Qualification Status
Qualified
Not Qualified
Reference Voltage-Nom
11.7 V
11.7 V
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Voltage Temp Coeff-Max
0.117 mV/°C
0.117 mV/°C
Voltage Tol-Max
4.96%
5%
Base Number Matches
1
1
Package Description
O-LALF-W2
ECCN Code
EAR99
HTS Code
8541.10.00.50
Reference Standard
MIL-19500/157
Working Test Current
7.5 mA
Compare JAN1N944B-1 with alternatives
Compare JAN1N944B with alternatives