JAN1N941B-1 vs 1N941B-1E3 feature comparison

JAN1N941B-1 Microchip Technology Inc

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1N941B-1E3 Microsemi Corporation

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Rohs Code No Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROSEMI CORP
Reach Compliance Code compliant compliant
Additional Feature METALLURGICALLY BONDED METALLURGICALLY BONDED
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code DO-35 DO-204AH
JESD-30 Code O-LALF-W2 O-LALF-W2
JESD-609 Code e0 e3
Number of Elements 1 1
Number of Terminals 2 2
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Power Dissipation-Max 0.5 W 0.5 W
Qualification Status Qualified
Reference Voltage-Nom 11.7 V 11.7 V
Surface Mount NO NO
Technology ZENER ZENER
Terminal Finish TIN LEAD MATTE TIN
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Voltage Temp Coeff-Max 1.17 mV/°C 1.17 mV/°C
Voltage Tol-Max 4.96% 5%
Base Number Matches 1 1
Pbfree Code Yes
Package Description O-LALF-W2
ECCN Code EAR99
HTS Code 8541.10.00.50
Operating Temperature-Max 175 °C
Operating Temperature-Min -55 °C

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