JAN1N821-1
vs
1N821-1
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
COBHAM PLC
MICROCHIP TECHNOLOGY INC
Package Description
HERMETIC SEALED PACKAGE-2
DO-35, 2 PIN
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
HTS Code
8541.10.00.50
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JEDEC-95 Code
DO-35
DO-204AH
JESD-30 Code
O-XALF-W2
O-LALF-W2
JESD-609 Code
e0
e0
Number of Elements
1
1
Number of Terminals
2
2
Package Body Material
UNSPECIFIED
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Power Dissipation-Max
0.5 W
0.5 W
Qualification Status
Not Qualified
Not Qualified
Reference Standard
MIL-19500/159M
MIL-19500
Reference Voltage-Nom
6.2 V
6.2 V
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Voltage Temp Coeff-Max
0.62 mV/°C
0.62 mV/°C
Voltage Tol-Max
4.84%
5%
Base Number Matches
8
8
Rohs Code
Factory Lead Time
26 Weeks
Additional Feature
METALLURGICALLY BONDED
Dynamic Impedance-Max
15 Ω
Operating Temperature-Max
175 °C
Operating Temperature-Min
-55 °C
Reverse Current-Max
2 µA
Reverse Test Voltage
3 V
Working Test Current
7.5 mA
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