JAN1N758CUR vs 1N758CUR-1E3 feature comparison

JAN1N758CUR MACOM

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1N758CUR-1E3 Microsemi Corporation

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Part Life Cycle Code Active Transferred
Ihs Manufacturer M/A-COM TECHNOLOGY SOLUTIONS INC MICROSEMI CORP
Package Description O-LELF-R2 O-LELF-R2
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code DO-213AA DO-213AA
JESD-30 Code O-LELF-R2 O-LELF-R2
JESD-609 Code e0
Number of Elements 1 1
Number of Terminals 2 2
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.5 W 0.5 W
Qualification Status Not Qualified
Reference Standard MIL-19500/127
Reference Voltage-Nom 10 V 10 V
Surface Mount YES YES
Technology ZENER ZENER
Terminal Finish TIN LEAD
Terminal Form WRAP AROUND WRAP AROUND
Terminal Position END END
Voltage Tol-Max 2% 2%
Working Test Current 20 mA 20 mA
Base Number Matches 3 1
Rohs Code Yes
Additional Feature METALLURGICALLY BONDED
Dynamic Impedance-Max 17 Ω
Operating Temperature-Max 175 °C

Compare JAN1N758CUR with alternatives

Compare 1N758CUR-1E3 with alternatives