JAN1N758CUR
vs
1N758CUR-1E3
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
M/A-COM TECHNOLOGY SOLUTIONS INC
MICROSEMI CORP
Package Description
O-LELF-R2
O-LELF-R2
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JEDEC-95 Code
DO-213AA
DO-213AA
JESD-30 Code
O-LELF-R2
O-LELF-R2
JESD-609 Code
e0
Number of Elements
1
1
Number of Terminals
2
2
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
0.5 W
Qualification Status
Not Qualified
Reference Standard
MIL-19500/127
Reference Voltage-Nom
10 V
10 V
Surface Mount
YES
YES
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
Terminal Form
WRAP AROUND
WRAP AROUND
Terminal Position
END
END
Voltage Tol-Max
2%
2%
Working Test Current
20 mA
20 mA
Base Number Matches
3
1
Rohs Code
Yes
Additional Feature
METALLURGICALLY BONDED
Dynamic Impedance-Max
17 Ω
Operating Temperature-Max
175 °C
Compare JAN1N758CUR with alternatives
Compare 1N758CUR-1E3 with alternatives