JAN1N6640US vs JANTXV1N6641US feature comparison

JAN1N6640US Microsemi Corporation

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JANTXV1N6641US Cobham Semiconductor Solutions

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MICROSEMI CORP AEROFLEX/METELICS INC
Package Description SURFACE MOUNT PACKAGE-2 HERMETIC SEALED GLASS PACKAGE-2
Pin Count 2 2
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.70 8541.10.00.70
Additional Feature METALLURGICALLY BONDED METALLURGICALLY BONDED
Application GENERAL PURPOSE
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type RECTIFIER DIODE RECTIFIER DIODE
JESD-30 Code O-XELF-R2 O-LELF-R2
JESD-609 Code e0 e0
Number of Elements 1 1
Number of Phases 1
Number of Terminals 2 2
Output Current-Max 0.3 A 0.3 A
Package Body Material UNSPECIFIED GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Qualification Status Not Qualified Not Qualified
Reference Standard MIL-19500/609D MIL-19500/578
Reverse Recovery Time-Max 0.004 µs 0.005 µs
Surface Mount YES YES
Terminal Finish TIN LEAD TIN LEAD
Terminal Form WRAP AROUND WRAP AROUND
Terminal Position END END
Base Number Matches 10 10
Rep Pk Reverse Voltage-Max 50 V

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Compare JANTXV1N6641US with alternatives