JAN1N6640US
vs
1N6640
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
SENSITRON SEMICONDUCTOR
MICROCHIP TECHNOLOGY INC
Package Description
SURFACE MOUNT PACKAGE-2
HERMETIC SEALED PACKAGE-2
Pin Count
2
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
HTS Code
8541.10.00.70
Additional Feature
METALLURGICALLY BONDED
Application
GENERAL PURPOSE
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
RECTIFIER DIODE
RECTIFIER DIODE
Forward Voltage-Max (VF)
1.1 V
1 V
JESD-30 Code
O-XELF-R2
O-LALF-W2
Non-rep Pk Forward Current-Max
2.5 A
2.5 A
Number of Elements
1
1
Number of Phases
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
175 °C
Output Current-Max
0.3 A
0.3 A
Package Body Material
UNSPECIFIED
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Qualified
Not Qualified
Reference Standard
MIL-19500/609D
Rep Pk Reverse Voltage-Max
75 V
Reverse Recovery Time-Max
0.004 µs
0.004 µs
Surface Mount
YES
NO
Terminal Form
WRAP AROUND
WIRE
Terminal Position
END
AXIAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Base Number Matches
1
13
Factory Lead Time
23 Weeks
JEDEC-95 Code
DO-35
JESD-609 Code
e0
Operating Temperature-Min
-65 °C
Reverse Current-Max
0.1 µA
Terminal Finish
TIN LEAD
Compare JAN1N6640US with alternatives
Compare 1N6640 with alternatives