JAN1N6622US
vs
SPD6622SMTX
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
SENSITRON SEMICONDUCTOR
|
SOLID STATE DEVICES INC
|
Package Description |
HERMETIC SEALED, GLASS, D-5A, 2 PIN
|
O-LELF-R2
|
Pin Count |
2
|
2
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.80
|
8541.10.00.80
|
Additional Feature |
METALLURGICALLY BONDED
|
|
Application |
ULTRA FAST RECOVERY
|
EFFICIENCY
|
Case Connection |
ISOLATED
|
ISOLATED
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
Forward Voltage-Max (VF) |
1.4 V
|
1.6 V
|
JESD-30 Code |
O-LELF-R2
|
O-LELF-R2
|
Non-rep Pk Forward Current-Max |
20 A
|
20 A
|
Number of Elements |
1
|
1
|
Number of Phases |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
175 °C
|
175 °C
|
Output Current-Max |
2 A
|
2 A
|
Package Body Material |
GLASS
|
GLASS
|
Package Shape |
ROUND
|
ROUND
|
Package Style |
LONG FORM
|
LONG FORM
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Qualification Status |
Qualified
|
|
Reference Standard |
MIL-19500/585
|
|
Rep Pk Reverse Voltage-Max |
600 V
|
600 V
|
Reverse Recovery Time-Max |
0.03 µs
|
0.03 µs
|
Surface Mount |
YES
|
YES
|
Technology |
AVALANCHE
|
|
Terminal Form |
WRAP AROUND
|
WRAP AROUND
|
Terminal Position |
END
|
END
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Base Number Matches |
1
|
2
|
Operating Temperature-Min |
|
-65 °C
|
Reverse Current-Max |
|
2 µA
|
|
|
|
Compare JAN1N6622US with alternatives
Compare SPD6622SMTX with alternatives