JAN1N6133US
vs
1N6133US
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
SENSITRON SEMICONDUCTOR
Package Description
MELF-2
HERMETIC SEALED, GLASS, MELF-2
Reach Compliance Code
compliant
compliant
Factory Lead Time
25 Weeks
Additional Feature
HIGH RELIABILITY
METALLURGICALLY BONDED
Breakdown Voltage-Min
117.33 V
123.5 V
Clamping Voltage-Max
187.7 V
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
TRANS VOLTAGE SUPPRESSOR DIODE
TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 Code
O-LELF-R2
O-LELF-R2
JESD-609 Code
e0
Non-rep Peak Rev Power Dis-Max
500 W
500 W
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
Operating Temperature-Min
-55 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
BIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
2 W
2 W
Qualification Status
Qualified
Not Qualified
Reference Standard
MIL-19500
Rep Pk Reverse Voltage-Max
98.8 V
98.8 V
Reverse Current-Max
1 µA
Reverse Test Voltage
98.8 V
Surface Mount
YES
YES
Technology
AVALANCHE
AVALANCHE
Terminal Finish
TIN LEAD
Terminal Form
WRAP AROUND
WRAP AROUND
Terminal Position
END
END
Base Number Matches
1
7
Pbfree Code
Part Package Code
MELF
Pin Count
2
ECCN Code
EAR99
HTS Code
8541.10.00.50
Case Connection
ISOLATED
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare JAN1N6133US with alternatives
Compare 1N6133US with alternatives