JAN1N5819-1
vs
EGP08F
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
DEFENSE LOGISTICS AGENCY
|
FAGOR ELECTRONICA S COOP
|
| Package Description |
HERMETIC SEALED PACKAGE-2
|
PLASTIC, MINI PACKAGE-2
|
| Reach Compliance Code |
unknown
|
compliant
|
| Additional Feature |
METALLURGICALLY BONDED
|
|
| Application |
GENERAL PURPOSE
|
GENERAL PURPOSE
|
| Case Connection |
ISOLATED
|
ISOLATED
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| JEDEC-95 Code |
DO-41
|
DO-41
|
| JESD-30 Code |
O-XALF-W2
|
O-PALF-W2
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Output Current-Max |
1 A
|
0.8 A
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
LONG FORM
|
LONG FORM
|
| Qualification Status |
Qualified
|
Not Qualified
|
| Reference Standard |
MIL-19500/586F
|
IEC-134; UL RECOGNIZED
|
| Surface Mount |
NO
|
NO
|
| Technology |
SCHOTTKY
|
AVALANCHE
|
| Terminal Form |
WIRE
|
WIRE
|
| Terminal Position |
AXIAL
|
AXIAL
|
| Base Number Matches |
5
|
1
|
| Rohs Code |
|
Yes
|
| Part Package Code |
|
DO-41
|
| Pin Count |
|
2
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8541.10.00.80
|
| Forward Voltage-Max (VF) |
|
1.25 V
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
1
|
| Non-rep Pk Forward Current-Max |
|
25 A
|
| Operating Temperature-Max |
|
150 °C
|
| Operating Temperature-Min |
|
-65 °C
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Rep Pk Reverse Voltage-Max |
|
300 V
|
| Reverse Recovery Time-Max |
|
0.05 µs
|
| Terminal Finish |
|
Matte Tin (Sn)
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare JAN1N5819-1 with alternatives
Compare EGP08F with alternatives