JAN1N5809URS
vs
1N5809US
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
M/A-COM TECHNOLOGY SOLUTIONS INC
Package Description
HERMETIC SEALED, GLASS, MELF-2
Reach Compliance Code
compliant
compliant
Additional Feature
HIGH RELIABILITY, METALLURGICALLY BONDED
Application
ULTRA FAST RECOVERY
ULTRA FAST RECOVERY POWER
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
RECTIFIER DIODE
RECTIFIER DIODE
JESD-30 Code
O-LELF-R2
O-LELF-R2
Non-rep Pk Forward Current-Max
125 A
125 A
Number of Elements
1
1
Number of Phases
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
Operating Temperature-Min
-65 °C
Output Current-Max
3 A
3 A
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Qualification Status
Qualified
Reference Standard
MIL-19500
Rep Pk Reverse Voltage-Max
100 V
100 V
Reverse Recovery Time-Max
0.03 µs
0.03 µs
Surface Mount
YES
YES
Terminal Form
WRAP AROUND
WRAP AROUND
Terminal Position
END
END
Base Number Matches
1
5
ECCN Code
EAR99
HTS Code
8541.10.00.80
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