JAN1N5806URS
vs
SR1150-AP-HF
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Not Recommended
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICRO COMMERCIAL COMPONENTS CORP
Package Description
HERMETIC SEALED, GLASS, MELF-2
Reach Compliance Code
compliant
not_compliant
Additional Feature
HIGH RELIABILITY
LOW POWER LOSS
Application
GENERAL PURPOSE
GENERAL PURPOSE
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
RECTIFIER DIODE
RECTIFIER DIODE
JESD-30 Code
O-LELF-R2
O-PALF-W2
JESD-609 Code
e0
e3
Number of Elements
1
1
Number of Phases
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
150 °C
Operating Temperature-Min
-65 °C
-50 °C
Output Current-Max
1 A
1 A
Package Body Material
GLASS
PLASTIC/EPOXY
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Qualification Status
Qualified
Reference Standard
MIL-19500
Rep Pk Reverse Voltage-Max
150 V
150 V
Reverse Recovery Time-Max
0.025 µs
Surface Mount
YES
NO
Terminal Finish
Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
Matte Tin (Sn)
Terminal Form
WRAP AROUND
WIRE
Terminal Position
END
AXIAL
Base Number Matches
3
1
ECCN Code
EAR99
HTS Code
8541.10.00.80
JEDEC-95 Code
DO-41
Moisture Sensitivity Level
1
Non-rep Pk Forward Current-Max
40 A
Peak Reflow Temperature (Cel)
260
Technology
SCHOTTKY
Time@Peak Reflow Temperature-Max (s)
5
Compare JAN1N5806URS with alternatives
Compare SR1150-AP-HF with alternatives