JAN1N5621US
vs
BYM12-400-E3/96
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
VISHAY SEMICONDUCTORS
|
| Package Description |
HERMETIC SEALED, GLASS PACKAGE-2
|
O-PELF-R2
|
| Reach Compliance Code |
compliant
|
unknown
|
| Application |
GENERAL PURPOSE
|
EFFICIENCY
|
| Case Connection |
ISOLATED
|
ISOLATED
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| JESD-30 Code |
O-LELF-R2
|
O-LELF-R2
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Output Current-Max |
1 A
|
1 A
|
| Package Body Material |
GLASS
|
GLASS
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
LONG FORM
|
LONG FORM
|
| Qualification Status |
Qualified
|
Not Qualified
|
| Reference Standard |
MIL-19500/429J
|
|
| Reverse Recovery Time-Max |
0.3 µs
|
0.05 µs
|
| Surface Mount |
YES
|
YES
|
| Terminal Form |
WRAP AROUND
|
WRAP AROUND
|
| Terminal Position |
END
|
END
|
| Base Number Matches |
4
|
2
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
DO-213AB
|
| Pin Count |
|
2
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8541.10.00.80
|
| Samacsys Manufacturer |
|
Vishay
|
| Additional Feature |
|
FREE WHEELING DIODE; HIGH RELIABILITY
|
| Forward Voltage-Max (VF) |
|
1.25 V
|
| JEDEC-95 Code |
|
DO-213AB
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
1
|
| Non-rep Pk Forward Current-Max |
|
30 A
|
| Operating Temperature-Max |
|
175 °C
|
| Operating Temperature-Min |
|
-65 °C
|
| Rep Pk Reverse Voltage-Max |
|
400 V
|
| Reverse Current-Max |
|
5 µA
|
| Reverse Test Voltage |
|
400 V
|
| Terminal Finish |
|
MATTE TIN
|
|
|
|
Compare JAN1N5621US with alternatives
Compare BYM12-400-E3/96 with alternatives