JAN1N5618US
vs
SX5618UL
feature comparison
Pbfree Code |
No
|
No
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
MICROSEMI CORP
|
SENSITRON SEMICONDUCTOR
|
Package Description |
HERMETIC SEALED, GLASS PACKAGE-2
|
HERMETIC SEALED, GLASS, MELF-1, 2 PIN
|
Pin Count |
2
|
2
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.80
|
8541.10.00.80
|
Samacsys Manufacturer |
Microsemi Corporation
|
|
Additional Feature |
METALLURGICALLY BONDED
|
|
Application |
GENERAL PURPOSE
|
GENERAL PURPOSE
|
Case Connection |
ISOLATED
|
ISOLATED
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
JESD-30 Code |
O-LELF-R2
|
E-LELF-R2
|
JESD-609 Code |
e0
|
e0
|
Number of Elements |
1
|
1
|
Number of Phases |
1
|
1
|
Number of Terminals |
2
|
2
|
Output Current-Max |
1 A
|
1 A
|
Package Body Material |
GLASS
|
GLASS
|
Package Shape |
ROUND
|
ELLIPTICAL
|
Package Style |
LONG FORM
|
LONG FORM
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Reference Standard |
MIL-19500/427K
|
|
Reverse Recovery Time-Max |
2 µs
|
2 µs
|
Surface Mount |
YES
|
YES
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
WRAP AROUND
|
WRAP AROUND
|
Terminal Position |
END
|
END
|
Base Number Matches |
1
|
1
|
Part Package Code |
|
MELF
|
|
|
|
Compare JAN1N5618US with alternatives
Compare SX5618UL with alternatives