JAN1N5518B-1
vs
JANTX1N5518B
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
M/A-COM TECHNOLOGY SOLUTIONS INC
KNOX SEMICONDUCTORS INC
Package Description
HERMETIC SEALED PACKAGE-2
HERMETIC SEALED, GLASS PACKAGE-2
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Additional Feature
METALLURGICALLY BONDED
LOW NOISE
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JEDEC-95 Code
DO-35
JESD-30 Code
O-PALF-W2
O-LALF-W2
JESD-609 Code
e0
e0
Number of Elements
1
1
Number of Terminals
2
2
Package Body Material
PLASTIC/EPOXY
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
0.4 W
Qualification Status
Qualified
Not Qualified
Reference Standard
MIL-19500/437
MIL-19500/437
Reference Voltage-Nom
3.3 V
3.3 V
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Voltage Tol-Max
5%
5%
Working Test Current
0.02 mA
20 mA
Base Number Matches
8
4
Rohs Code
Pin Count
2
Dynamic Impedance-Max
26 Ω
Operating Temperature-Max
175 °C
Reverse Current-Max
5 µA
Voltage Temp Coeff-Max
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