JAN1N5291UR-1
vs
1N5291UR-1
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MICROSEMI CORP
MICROSEMI CORP
Part Package Code
DO-213AB
DO-213AB
Package Description
HERMETIC SEALED, GLASS, LL41, MELF-2
HERMETIC SEALED, GLASS, LL41, MELF-2
Pin Count
2
2
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.70
8541.10.00.70
Samacsys Manufacturer
Microsemi Corporation
Microsemi Corporation
Additional Feature
METALLURGICALLY BONDED
METALLURGICALLY BONDED
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
CURRENT REGULATOR DIODE
CURRENT REGULATOR DIODE
JEDEC-95 Code
DO-213AB
DO-213AB
JESD-30 Code
O-LELF-R2
O-LELF-R2
JESD-609 Code
e0
e0
Limiting Voltage-Max
1.1 V
1.1 V
Moisture Sensitivity Level
1
1
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
175 °C
Operating Temperature-Min
-65 °C
-65 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Power Dissipation-Max
0.5 W
0.5 W
Qualification Status
Not Qualified
Not Qualified
Reference Standard
MIL-19500
Regulation Current-Nom (Ireg)
0.56 mA
0.56 mA
Surface Mount
YES
YES
Technology
FIELD EFFECT
FIELD EFFECT
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
WRAP AROUND
WRAP AROUND
Terminal Position
END
END
Base Number Matches
2
9
Dynamic Impedance-Min
1900000 Ω
Rep Pk Reverse Voltage-Max
100 V
Compare JAN1N5291UR-1 with alternatives
Compare 1N5291UR-1 with alternatives