JAN1N5286 vs JANHCA1N5286 feature comparison

JAN1N5286 Microsemi Corporation

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JANHCA1N5286 Microsemi Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Part Package Code DO-7 DIE
Package Description O-LALF-W2 HERMETIC SEALED, DIE-2
Pin Count 2 2
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.70 8541.10.00.40
Case Connection ISOLATED CATHODE
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type CURRENT REGULATOR DIODE CURRENT REGULATOR DIODE
Dynamic Impedance-Min 9000000 Ω
JEDEC-95 Code DO-204AA
JESD-30 Code O-LALF-W2 S-XXUC-N2
JESD-609 Code e0 e0
Limiting Voltage-Max 1 V 1 V
Number of Elements 1 1
Number of Terminals 2 2
Package Body Material GLASS UNSPECIFIED
Package Shape ROUND SQUARE
Package Style LONG FORM UNCASED CHIP
Power Dissipation-Max 0.6 W
Qualification Status Not Qualified Not Qualified
Regulation Current-Nom (Ireg) 0.3 mA 0.3 mA
Rep Pk Reverse Voltage-Max 100 V
Surface Mount NO YES
Technology FIELD EFFECT FIELD EFFECT
Terminal Finish Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal Form WIRE NO LEAD
Terminal Position AXIAL UNSPECIFIED
Base Number Matches 5 1
Reference Standard MIL-19500/463G

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Compare JANHCA1N5286 with alternatives