JAN1N5190
vs
1N5190E3
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
|
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
SENSITRON SEMICONDUCTOR
|
MICROSEMI CORP
|
Package Description |
HERMETIC SEALED, 303, 2 PIN
|
O-LALF-W2
|
Pin Count |
2
|
2
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.80
|
8541.10.00.80
|
Application |
FAST RECOVERY
|
FAST RECOVERY
|
Case Connection |
ISOLATED
|
ISOLATED
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
Forward Voltage-Max (VF) |
1.1 V
|
|
JESD-30 Code |
O-LALF-W2
|
O-LALF-W2
|
JESD-609 Code |
e0
|
e3
|
Non-rep Pk Forward Current-Max |
80 A
|
80 A
|
Number of Elements |
1
|
1
|
Number of Phases |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
200 °C
|
175 °C
|
Output Current-Max |
2.5 A
|
3 A
|
Package Body Material |
GLASS
|
GLASS
|
Package Shape |
ROUND
|
ROUND
|
Package Style |
LONG FORM
|
LONG FORM
|
Qualification Status |
Qualified
|
|
Reference Standard |
MIL
|
|
Rep Pk Reverse Voltage-Max |
600 V
|
600 V
|
Reverse Recovery Time-Max |
0.4 µs
|
0.4 µs
|
Surface Mount |
NO
|
NO
|
Terminal Finish |
TIN LEAD
|
MATTE TIN OVER COPPER
|
Terminal Form |
WIRE
|
WIRE
|
Terminal Position |
AXIAL
|
AXIAL
|
Base Number Matches |
5
|
1
|
Additional Feature |
|
HIGH RELIABILITY
|
Operating Temperature-Min |
|
-65 °C
|
Technology |
|
AVALANCHE
|
|
|
|
Compare JAN1N5190 with alternatives
Compare 1N5190E3 with alternatives