JAN1N4994CUS
vs
BZT55B51-TP
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICRO COMMERCIAL COMPONENTS CORP
Package Description
HERMETIC SEALED, GLASS PACKAGE-2
QUADROMELF-2
Reach Compliance Code
compliant
unknown
Factory Lead Time
28 Weeks
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JESD-30 Code
O-LELF-R2
O-LELF-R2
JESD-609 Code
e0
e3
Number of Elements
1
1
Number of Terminals
2
2
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
5 W
0.5 W
Qualification Status
Qualified
Not Qualified
Reference Standard
MIL-19500/356H
Reference Voltage-Nom
330 V
51 V
Surface Mount
YES
YES
Technology
ZENER
ZENER
Terminal Finish
Tin/Lead (Sn/Pb)
MATTE TIN
Terminal Form
WRAP AROUND
WRAP AROUND
Terminal Position
END
END
Voltage Tol-Max
2%
2%
Working Test Current
4 mA
2.5 mA
Base Number Matches
3
1
Part Package Code
MELF
Pin Count
2
ECCN Code
EAR99
HTS Code
8541.10.00.50
Additional Feature
HIGH RELIABILITY
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
10
Compare JAN1N4994CUS with alternatives
Compare BZT55B51-TP with alternatives