JAN1N4984US
vs
1N4984US
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
MICROSEMI CORP
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
HERMETIC SEALED, GLASS PACKAGE-2
|
|
| Pin Count |
2
|
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8541.10.00.50
|
|
| Case Connection |
ISOLATED
|
ISOLATED
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
ZENER DIODE
|
ZENER DIODE
|
| Dynamic Impedance-Max |
70 Ω
|
|
| JESD-30 Code |
O-LELF-R2
|
R-LUFM-D2
|
| JESD-609 Code |
e0
|
e0
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
200 °C
|
|
| Package Body Material |
GLASS
|
GLASS
|
| Package Shape |
ROUND
|
RECTANGULAR
|
| Package Style |
LONG FORM
|
FLANGE MOUNT
|
| Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
| Power Dissipation-Max |
5 W
|
5 W
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Reference Standard |
MIL-19500/356H
|
|
| Reference Voltage-Nom |
120 V
|
120 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
ZENER
|
ZENER
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
| Terminal Form |
WRAP AROUND
|
SOLDER LUG
|
| Terminal Position |
END
|
UPPER
|
| Voltage Tol-Max |
5%
|
5%
|
| Working Test Current |
10 mA
|
10 mA
|
| Base Number Matches |
1
|
5
|
| Factory Lead Time |
|
28 Weeks
|
| Additional Feature |
|
HIGH RELIABILITY
|
|
|
|
Compare JAN1N4984US with alternatives
Compare 1N4984US with alternatives