JAN1N4982
vs
1N4982
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
BKC SEMICONDUCTORS INC
|
| Package Description |
HERMETIC SEALED, GLASS PACKAGE-2
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| Factory Lead Time |
28 Weeks
|
|
| Case Connection |
ISOLATED
|
ISOLATED
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
ZENER DIODE
|
ZENER DIODE
|
| Dynamic Impedance-Max |
40 Ω
|
40 Ω
|
| JESD-30 Code |
O-LALF-W2
|
O-LALF-W2
|
| JESD-609 Code |
e0
|
e0
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
175 °C
|
200 °C
|
| Operating Temperature-Min |
-65 °C
|
|
| Package Body Material |
GLASS
|
GLASS
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
LONG FORM
|
LONG FORM
|
| Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
| Power Dissipation-Max |
5 W
|
5 W
|
| Qualification Status |
Qualified
|
Not Qualified
|
| Reference Standard |
MIL-19500/356H
|
|
| Reference Voltage-Nom |
100 V
|
100 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
ZENER
|
ZENER
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
| Terminal Form |
WIRE
|
WIRE
|
| Terminal Position |
AXIAL
|
AXIAL
|
| Voltage Tol-Max |
5%
|
5%
|
| Working Test Current |
12 mA
|
12 mA
|
| Base Number Matches |
6
|
9
|
| Additional Feature |
|
HIGH SURGE CAPABILITY
|
| Knee Impedance-Max |
|
800 Ω
|
| Reverse Current-Max |
|
2 µA
|
| Voltage Temp Coeff-Max |
|
100 mV/°C
|
|
|
|
Compare JAN1N4982 with alternatives
Compare 1N4982 with alternatives