JAN1N4977 vs 1N4977E3 feature comparison

JAN1N4977 Microchip Technology Inc

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1N4977E3 Microsemi Corporation

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Rohs Code No
Part Life Cycle Code Active Transferred
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROSEMI CORP
Package Description HERMETIC SEALED, GLASS PACKAGE-2 O-LALF-W2
Reach Compliance Code compliant compliant
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JESD-30 Code O-LALF-W2 O-LALF-W2
JESD-609 Code e0
Number of Elements 1 1
Number of Terminals 2 2
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 5 W 5 W
Qualification Status Qualified
Reference Standard MIL-19500/356H
Reference Voltage-Nom 62 V 62 V
Surface Mount NO NO
Technology ZENER ZENER
Terminal Finish TIN LEAD
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Voltage Tol-Max 5% 5%
Working Test Current 20 mA 20 mA
Base Number Matches 6 1
ECCN Code EAR99
HTS Code 8541.10.00.50
Additional Feature HIGH SURGE CAPABILITY

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Compare 1N4977E3 with alternatives