JAN1N4961 vs MSP1N3021BUR-1E3 feature comparison

JAN1N4961 Semtech Corporation

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MSP1N3021BUR-1E3 Microsemi Corporation

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer SEMTECH CORP MICROSEMI CORP
Package Description HERMETIC SEALED PACKAGE-2 O-LELF-R2
Pin Count 2 2
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Samacsys Manufacturer SEMTECH
Additional Feature LOW IMPEDANCE METALLURGICALLY BONDED, HIGH RELIABILITY
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
Dynamic Impedance-Max 2 Ω
JESD-30 Code O-XALF-W2 O-LELF-R2
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 200 °C 175 °C
Package Body Material UNSPECIFIED GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 5 W 1.25 W
Qualification Status Qualified Not Qualified
Reference Standard MIL-19500
Reference Voltage-Nom 13 V 11 V
Surface Mount NO YES
Technology ZENER ZENER
Terminal Form WIRE WRAP AROUND
Terminal Position AXIAL END
Voltage Tol-Max 5% 5%
Working Test Current 100 mA 23 mA
Base Number Matches 2 2
Rohs Code Yes
Part Package Code DO-213AB
JEDEC-95 Code DO-213AB
JESD-609 Code e3
Operating Temperature-Min -65 °C
Terminal Finish MATTE TIN

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