JAN1N4623-1
vs
1N4623-1
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Active
|
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
|
| Package Description |
HERMETIC SEALED, GLASS PACKAGE-2
|
|
| Reach Compliance Code |
compliant
|
|
| Factory Lead Time |
20 Weeks
|
|
| Additional Feature |
METALLURGICALLY BONDED
|
|
| Case Connection |
ISOLATED
|
|
| Configuration |
SINGLE
|
|
| Diode Element Material |
SILICON
|
|
| Diode Type |
ZENER DIODE
|
|
| JEDEC-95 Code |
DO-35
|
|
| JESD-30 Code |
O-LALF-W2
|
|
| JESD-609 Code |
e0
|
|
| Number of Elements |
1
|
|
| Number of Terminals |
2
|
|
| Package Body Material |
GLASS
|
|
| Package Shape |
ROUND
|
|
| Package Style |
LONG FORM
|
|
| Polarity |
UNIDIRECTIONAL
|
|
| Power Dissipation-Max |
0.5 W
|
|
| Qualification Status |
Qualified
|
|
| Reference Standard |
MIL-19500/435
|
|
| Reference Voltage-Nom |
4.3 V
|
|
| Surface Mount |
NO
|
|
| Technology |
ZENER
|
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
WIRE
|
|
| Terminal Position |
AXIAL
|
|
| Voltage Tol-Max |
5%
|
|
| Working Test Current |
0.25 mA
|
|
| Base Number Matches |
1
|
|
|
|
|
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