JAN1N4582AUR-1
vs
JANS1N4582AUR-1
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
M/A-COM TECHNOLOGY SOLUTIONS INC
MICROCHIP TECHNOLOGY INC
Package Description
MELF-2
HERMETIC SEALED, GLASS, LL34, MELF-2
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
HTS Code
8541.10.00.50
Additional Feature
METALLURGICALLY BONDED
METALLURGICALLY BONDED
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JEDEC-95 Code
DO-213AA
DO-213AA
JESD-30 Code
O-LELF-R2
O-LELF-R2
JESD-609 Code
e0
e0
Number of Elements
1
1
Number of Terminals
2
2
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Power Dissipation-Max
0.5 W
0.5 W
Qualification Status
Qualified
Qualified
Reference Standard
MIL-19500/452
MIL-19500/452
Reference Voltage-Nom
6.4 V
6.4 V
Surface Mount
YES
YES
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
WRAP AROUND
WRAP AROUND
Terminal Position
END
END
Voltage Temp Coeff-Max
0.128 mV/°C
0.128 mV/°C
Voltage Tol-Max
5%
5%
Base Number Matches
8
8
Rohs Code
Factory Lead Time
39 Weeks
Moisture Sensitivity Level
1
Polarity
UNIDIRECTIONAL
Working Test Current
4 mA
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