JAN1N4486D
vs
JAN1N4488US
feature comparison
All Stats
Differences Only
Rohs Code
No
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROSS COMPONENTS
Package Description
HERMETIC SEALED, GLASS PACKAGE-2
Reach Compliance Code
compliant
compliant
Factory Lead Time
52 Weeks
29 Weeks
Additional Feature
HIGH RELIABILITY, METALLURGICALLY BONDED
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JEDEC-95 Code
DO-41
JESD-30 Code
O-LALF-W2
O-LELF-R2
JESD-609 Code
e0
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
175 °C
Operating Temperature-Min
-65 °C
-55 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
1.5 W
1.5 W
Qualification Status
Qualified
Reference Standard
MIL-19500
MIL-19500
Reference Voltage-Nom
75 V
91 V
Surface Mount
NO
YES
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
Terminal Form
WIRE
WRAP AROUND
Terminal Position
AXIAL
END
Voltage Tol-Max
1%
4.95%
Working Test Current
3.3 mA
2.8 mA
Base Number Matches
3
7
Dynamic Impedance-Max
200 Ω
Knee Impedance-Max
3000 Ω
Reverse Current-Max
0.25 µA
Reverse Test Voltage
72.8 V
Voltage Temp Coeff-Max
90.09 mV/°C
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