JAN1N4484 vs 1N4484USE3 feature comparison

JAN1N4484 Microsemi Corporation

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1N4484USE3 Microsemi Corporation

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Rohs Code No Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Package Description HERMETIC SEALED, GLASS PACKAGE-2
Reach Compliance Code unknown compliant
Additional Feature HIGH RELIABILITY, METALLURGICALLY BONDED
Case Connection ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code DO-41
JESD-30 Code O-LALF-W2
JESD-609 Code e0
Number of Elements 1 1
Number of Terminals 2
Operating Temperature-Max 175 °C 175 °C
Operating Temperature-Min -65 °C
Package Body Material GLASS
Package Shape ROUND
Package Style LONG FORM
Polarity UNIDIRECTIONAL
Power Dissipation-Max 1.5 W 1.5 W
Qualification Status Not Qualified
Reference Standard MIL-19500
Reference Voltage-Nom 62 V 62 V
Surface Mount NO YES
Technology ZENER ZENER
Terminal Finish TIN LEAD PURE MATTE TIN
Terminal Form WIRE
Terminal Position AXIAL
Voltage Tol-Max 5% 5%
Working Test Current 4 mA 4 mA
Base Number Matches 9 1
ECCN Code EAR99
HTS Code 8541.10.00.50
Dynamic Impedance-Max 80 Ω

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