JAN1N4371D
vs
JANTXV1N4371C-1
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
M/A-COM TECHNOLOGY SOLUTIONS INC
MICROSEMI CORP
Package Description
HERMETIC SEALED PACKAGE-2
HERMETIC SEALED, GLASS PACKAGE-2
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JEDEC-95 Code
DO-35
DO-35
JESD-30 Code
O-PALF-W2
O-LALF-W2
JESD-609 Code
e0
e0
Number of Elements
1
1
Number of Terminals
2
2
Package Body Material
PLASTIC/EPOXY
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
0.5 W
Qualification Status
Not Qualified
Not Qualified
Reference Standard
MIL-19500/127
MIL-19500/127
Reference Voltage-Nom
2.7 V
2.7 V
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Voltage Tol-Max
1%
2%
Working Test Current
20 mA
20 mA
Base Number Matches
3
1
Pbfree Code
Rohs Code
Samacsys Manufacturer
Microsemi Corporation
Additional Feature
METALLURGICALLY BONDED
Compare JAN1N4371D with alternatives
Compare JANTXV1N4371C-1 with alternatives