JAN1N4106D
vs
JANHCA1N4106C
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
M/A-COM TECHNOLOGY SOLUTIONS INC
MICROCHIP TECHNOLOGY INC
Package Description
HERMETIC SEALED, GLASS PACKAGE-2
DIE-2
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
HTS Code
8541.10.00.50
Case Connection
ISOLATED
CATHODE
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JEDEC-95 Code
DO-35
JESD-30 Code
O-LALF-W2
S-XXUC-N2
JESD-609 Code
e0
e0
Number of Elements
1
1
Number of Terminals
2
2
Package Body Material
GLASS
UNSPECIFIED
Package Shape
ROUND
SQUARE
Package Style
LONG FORM
UNCASED CHIP
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
0.25 W
Qualification Status
Not Qualified
Qualified
Reference Standard
MIL-19500/435
MIL-19500/435F
Reference Voltage-Nom
12 V
12 V
Surface Mount
NO
YES
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
WIRE
NO LEAD
Terminal Position
AXIAL
UNSPECIFIED
Voltage Tol-Max
1%
2%
Working Test Current
0.25 mA
0.25 mA
Base Number Matches
5
4
Rohs Code
Additional Feature
METALLURGICALLY BONDED
Dynamic Impedance-Max
200 Ω
Operating Temperature-Max
200 °C
Compare JAN1N4106D with alternatives
Compare JANHCA1N4106C with alternatives