JAN1N3309B
vs
JAN1N2808D
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA INC
MICROSEMI CORP
Package Description
O-MUPM-D1
O-MBFM-P2
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Case Connection
ANODE
ANODE
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JESD-30 Code
O-MUPM-D1
O-MBFM-P2
Knee Impedance-Max
80 Ω
Number of Elements
1
1
Number of Terminals
1
2
Operating Temperature-Max
175 °C
175 °C
Operating Temperature-Min
-65 °C
-65 °C
Package Body Material
METAL
METAL
Package Shape
ROUND
ROUND
Package Style
POST/STUD MOUNT
FLANGE MOUNT
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
50 W
50 W
Qualification Status
Not Qualified
Not Qualified
Reference Voltage-Nom
10 V
10 V
Reverse Current-Max
10 µA
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Form
SOLDER LUG
PIN/PEG
Terminal Position
UPPER
BOTTOM
Voltage Temp Coeff-Max
5.5 mV/°C
Voltage Tol-Max
5%
1%
Working Test Current
1200 mA
1200 mA
Base Number Matches
5
1
Pbfree Code
No
Rohs Code
No
Part Package Code
TO-3
Pin Count
2
JEDEC-95 Code
TO-204AD
Reference Standard
MIL-19500
Compare JAN1N3309B with alternatives
Compare JAN1N2808D with alternatives