JAN1N3033D-1
vs
MSP1N4753DGE3
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROSEMI CORP
Package Description
DO-41, 2 PIN
O-LALF-W2
Reach Compliance Code
compliant
unknown
Factory Lead Time
52 Weeks
Additional Feature
METALLURGICALLY BONDED
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JEDEC-95 Code
DO-41
DO-204AL
JESD-30 Code
O-XALF-W2
O-LALF-W2
JESD-609 Code
e0
e3
Number of Elements
1
1
Number of Terminals
2
2
Package Body Material
UNSPECIFIED
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
1 W
1 W
Qualification Status
Qualified
Not Qualified
Reference Standard
MIL-19500/115K
Reference Voltage-Nom
36 V
36 V
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
MATTE TIN
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Voltage Tol-Max
1%
1%
Working Test Current
7 mA
7 mA
Base Number Matches
1
2
Part Package Code
DO-204
Pin Count
2
ECCN Code
EAR99
HTS Code
8541.10.00.50
Moisture Sensitivity Level
1
Operating Temperature-Max
175 °C
Operating Temperature-Min
-65 °C
Compare JAN1N3033D-1 with alternatives
Compare MSP1N4753DGE3 with alternatives