JAN1N3027C-1 vs 1N3027CE3 feature comparison

JAN1N3027C-1 Compensated Devices Inc

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1N3027CE3 Microsemi Corporation

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer COMPENSATED DEVICES INC MICROSEMI CORP
Package Description DO-41, 2 PIN O-LALF-W2
Reach Compliance Code unknown compliant
Additional Feature METALLURGICALLY BONDED METALLURGICALLY BONDED
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code DO-41 DO-41
JESD-30 Code O-XALF-W2 O-LALF-W2
Number of Elements 1 1
Number of Terminals 2 2
Package Body Material UNSPECIFIED GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 1 W 1 W
Qualification Status Not Qualified Not Qualified
Reference Standard MIL-19500/115K
Reference Voltage-Nom 20 V 20 V
Surface Mount NO NO
Technology ZENER ZENER
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Voltage Tol-Max 2% 2%
Working Test Current 12.5 mA 12.5 mA
Base Number Matches 5 1
Rohs Code Yes
Part Package Code DO-13
Pin Count 2
ECCN Code EAR99
HTS Code 8541.10.00.50
Dynamic Impedance-Max 22 Ω
Operating Temperature-Max 175 °C
Operating Temperature-Min -65 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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