JAN1N3017D-1 vs MSP1N4737CURE3 feature comparison

JAN1N3017D-1 Microsemi Corporation

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MSP1N4737CURE3 Microsemi Corporation

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Rohs Code No Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Package Description DO-41, 2 PIN O-LELF-R2
Reach Compliance Code unknown unknown
Additional Feature METALLURGICALLY BONDED HIGH RELIABILITY
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code DO-41 DO-213AB
JESD-30 Code O-XALF-W2 O-LELF-R2
JESD-609 Code e0 e3
Number of Elements 1 1
Number of Terminals 2 2
Package Body Material UNSPECIFIED GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 1 W 1 W
Qualification Status Not Qualified Not Qualified
Reference Standard MIL-19500/115K MIL-19500
Reference Voltage-Nom 7.5 V 7.5 V
Surface Mount NO YES
Technology ZENER ZENER
Terminal Finish TIN LEAD MATTE TIN
Terminal Form WIRE WRAP AROUND
Terminal Position AXIAL END
Voltage Tol-Max 1% 2%
Working Test Current 34 mA 34 mA
Base Number Matches 5 1
Part Package Code DO-213AB
Pin Count 2
ECCN Code EAR99
HTS Code 8541.10.00.50
Operating Temperature-Max 175 °C
Operating Temperature-Min -65 °C

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