JAN1N2999B
vs
1N2999B
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
MICROSEMI CORP
MICROCHIP TECHNOLOGY INC
Part Package Code
DO-4
Package Description
HERMETIC SEALED, GLASS, DO-4, 1 PIN
HERMETIC SEALED, GLASS, DO-4, 1 PIN
Pin Count
1
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
HTS Code
8541.10.00.50
Case Connection
ANODE
ANODE
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JEDEC-95 Code
DO-203AA
DO-203AA
JESD-30 Code
O-MUPM-D1
O-MUPM-D1
JESD-609 Code
e0
e0
Number of Elements
1
1
Number of Terminals
1
1
Operating Temperature-Max
175 °C
175 °C
Operating Temperature-Min
-65 °C
-65 °C
Package Body Material
METAL
METAL
Package Shape
ROUND
ROUND
Package Style
POST/STUD MOUNT
POST/STUD MOUNT
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
10 W
10 W
Qualification Status
Not Qualified
Not Qualified
Reference Standard
MIL-19500/124
Reference Voltage-Nom
56 V
56 V
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
TIN LEAD OVER NICKEL
Terminal Form
SOLDER LUG
SOLDER LUG
Terminal Position
UPPER
UPPER
Voltage Tol-Max
5%
5%
Working Test Current
45 mA
45 mA
Base Number Matches
1
4
Factory Lead Time
35 Weeks
Dynamic Impedance-Max
16 Ω
Compare JAN1N2999B with alternatives
Compare 1N2999B with alternatives