JAN1N2834B vs 1N3336RD feature comparison

JAN1N2834B Microchip Technology Inc

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1N3336RD Microsemi Corporation

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Rohs Code No No
Part Life Cycle Code Active Transferred
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROSEMI CORP
Package Description TO-3, 2 PIN HERMETIC SEALED, METAL GLASS, DO-5, 1 PIN
Reach Compliance Code compliant unknown
Factory Lead Time 35 Weeks
Case Connection ANODE CATHODE
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code TO-204AD DO-203AB
JESD-30 Code O-MBFM-P2 O-MUPM-D1
JESD-609 Code e0
Number of Elements 1 1
Number of Terminals 2 1
Operating Temperature-Max 175 °C 175 °C
Operating Temperature-Min -65 °C -65 °C
Package Body Material METAL METAL
Package Shape ROUND ROUND
Package Style FLANGE MOUNT POST/STUD MOUNT
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 50 W 50 W
Qualification Status Qualified Not Qualified
Reference Standard MIL-19500
Reference Voltage-Nom 68 V 68 V
Surface Mount NO NO
Technology ZENER ZENER
Terminal Finish TIN LEAD OVER NICKEL
Terminal Form PIN/PEG SOLDER LUG
Terminal Position BOTTOM UPPER
Voltage Tol-Max 5% 1%
Working Test Current 180 mA 180 mA
Base Number Matches 5 1
Part Package Code DO-5
Pin Count 1
ECCN Code EAR99
HTS Code 8541.10.00.50
Additional Feature PD-CASE
Dynamic Impedance-Max 8 Ω
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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