ISPLSI2128VE-180LB100
vs
ISPLSI2128VE-100LB100
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
LATTICE SEMICONDUCTOR CORP
LATTICE SEMICONDUCTOR CORP
Part Package Code
BGA
BGA
Package Description
CABGA-100
CABGA-100
Pin Count
100
100
Reach Compliance Code
not_compliant
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
USE ISPLSI 2128VE-250 FOR NEW DESIGNS
YES
Clock Frequency-Max
125 MHz
77 MHz
In-System Programmable
YES
YES
JESD-30 Code
S-PBGA-B100
S-PBGA-B100
JESD-609 Code
e0
e0
JTAG BST
NO
NO
Length
10 mm
10 mm
Moisture Sensitivity Level
3
3
Number of Dedicated Inputs
4
4
Number of I/O Lines
64
64
Number of Macro Cells
128
128
Number of Terminals
100
100
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
4 DEDICATED INPUTS, 64 I/O
4 DEDICATED INPUTS, 64 I/O
Output Function
MACROCELL
MACROCELL
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
LFBGA
Package Equivalence Code
BGA100,10X10,32
BGA100,10X10,32
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
240
240
Programmable Logic Type
EE PLD
EE PLD
Propagation Delay
7.5 ns
13 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.5 mm
1.5 mm
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3 V
3 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Tin/Lead (Sn63Pb37)
Tin/Lead (Sn63Pb37)
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
10 mm
10 mm
Base Number Matches
1
1
Compare ISPLSI2128VE-180LB100 with alternatives
Compare ISPLSI2128VE-100LB100 with alternatives