ISP1763AHNUM
vs
USS2X1W
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
ST-ERICSSON
|
BROADCOM INC
|
| Part Package Code |
QFN
|
|
| Package Description |
HVQCCN, LCC64,.35SQ,20
|
TQFP-64
|
| Pin Count |
64
|
|
| Manufacturer Package Code |
VFQFPN
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
16
|
|
| Bus Compatibility |
PCI
|
|
| Clock Frequency-Max |
24 MHz
|
30 MHz
|
| Data Transfer Rate-Max |
60 MBps
|
60 MBps
|
| External Data Bus Width |
16
|
16
|
| JESD-30 Code |
S-PQCC-N64
|
S-PQFP-G64
|
| Length |
9 mm
|
10 mm
|
| Number of Terminals |
64
|
64
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
LFQFP
|
| Package Equivalence Code |
LCC64,.35SQ,20
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
FLATPACK, LOW PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
240
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1 mm
|
1.6 mm
|
| Supply Voltage-Max |
3.6 V
|
3.465 V
|
| Supply Voltage-Min |
3 V
|
3.135 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
| Width |
9 mm
|
10 mm
|
| uPs/uCs/Peripheral ICs Type |
BUS CONTROLLER, UNIVERSAL SERIAL BUS
|
BUS CONTROLLER, UNIVERSAL SERIAL BUS
|
| Base Number Matches |
2
|
3
|
| ECCN Code |
|
3A991.A.2
|
| JESD-609 Code |
|
e0
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
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