ISP1160BD,151 vs ISP1161ABM feature comparison

ISP1160BD,151 ST-Ericsson

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ISP1161ABM Philips Semiconductors

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer ST-ERICSSON PHILIPS SEMICONDUCTORS
Part Package Code QFP
Package Description LFQFP, QFP, QFP64,.35SQ,16
Pin Count 64
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature OPERATES AT 5V SUPPLY WITH REGULATOR
Address Bus Width 1
Bus Compatibility SH-3; SH-4; ARM7; ARM9; STRONGARM; MIPS
Clock Frequency-Max 6 MHz
Data Transfer Rate-Max 1.5 MBps
External Data Bus Width 16
JESD-30 Code S-PQFP-G64 S-PQFP-G64
Length 10 mm
Number of Terminals 64 64
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFQFP QFP
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH FLATPACK
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3 V
Supply Voltage-Nom 3.3 V
Surface Mount YES YES
Technology CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.4 mm
Terminal Position QUAD QUAD
Width 10 mm
uPs/uCs/Peripheral ICs Type BUS CONTROLLER, UNIVERSAL SERIAL BUS
Base Number Matches 2 3
Rohs Code Yes
Moisture Sensitivity Level 2
Package Equivalence Code QFP64,.35SQ,16
Peak Reflow Temperature (Cel) 260

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