ISO106
vs
HCPL-788J500
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
BURR-BROWN CORP
|
HEWLETT PACKARD CO
|
Package Description |
CERAMIC, DIP-40
|
,
|
Reach Compliance Code |
unknown
|
unknown
|
Amplifier Type |
ISOLATION AMPLIFIER
|
ISOLATION AMPLIFIER
|
Bandwidth (3dB)-Nom |
70 MHz
|
30 MHz
|
Common Mode Voltage-Max |
3500 V
|
|
Isolation Voltage-Min |
3500 V
|
3750 V
|
JESD-30 Code |
R-CDIP-T16
|
R-PDSO-G16
|
JESD-609 Code |
e0
|
|
Neg Supply Voltage Limit-Max |
-20 V
|
|
Neg Supply Voltage-Nom (Vsup) |
-15 V
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-55 °C
|
-40 °C
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
|
Package Equivalence Code |
DIP16/40,.6
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
SMALL OUTLINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Current-Max |
80 mA
|
|
Supply Voltage Limit-Max |
20 V
|
5.5 V
|
Supply Voltage-Nom (Vsup) |
15 V
|
5 V
|
Surface Mount |
NO
|
YES
|
Technology |
BIPOLAR
|
|
Temperature Grade |
MILITARY
|
INDUSTRIAL
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
Terminal Form |
THROUGH-HOLE
|
GULL WING
|
Terminal Pitch |
2.54 mm
|
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
2
|
3
|
Part Package Code |
|
SOIC
|
Pin Count |
|
16
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8542.33.00.01
|
Voltage Gain-Max |
|
8.332
|
Voltage Gain-Min |
|
7.539
|
|
|
|
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