ISL98001CQZ-170
vs
ISL98001IQZ-140
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
RENESAS ELECTRONICS CORP
|
Part Package Code |
MQFP
|
MQFP
|
Package Description |
MQFP-128
|
MQFP-128
|
Pin Count |
128
|
128
|
Manufacturer Package Code |
MDP0055
|
MDP0055
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
4 Weeks
|
|
Samacsys Manufacturer |
Renesas Electronics
|
Renesas Electronics
|
Consumer IC Type |
CONSUMER CIRCUIT
|
CONSUMER CIRCUIT
|
JESD-30 Code |
R-PQFP-G128
|
R-PQFP-G128
|
JESD-609 Code |
e3
|
e3
|
Length |
20 mm
|
20 mm
|
Moisture Sensitivity Level |
2
|
2A
|
Number of Functions |
1
|
1
|
Number of Terminals |
128
|
128
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HFQFP
|
HFQFP
|
Package Equivalence Code |
QFP128,.67X.93,20
|
QFP128,.67X.93,20
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
FLATPACK, HEAT SINK/SLUG, FINE PITCH
|
FLATPACK, HEAT SINK/SLUG, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Seated Height-Max |
3.4 mm
|
3.4 mm
|
Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Finish |
Matte Tin (Sn) - annealed
|
Matte Tin (Sn) - annealed
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
14 mm
|
14 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare ISL98001CQZ-170 with alternatives
Compare ISL98001IQZ-140 with alternatives