ISL9307IRTAANLZ-T7A
vs
ISL9307IRTAAJGZ-T
feature comparison
Pbfree Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
RENESAS ELECTRONICS CORP
|
Part Package Code |
TQFN
|
TQFN
|
Package Description |
TQFN-16
|
TQFN-16
|
Pin Count |
16
|
16
|
Manufacturer Package Code |
L16.4X4G
|
L16.4X4G
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
26 Weeks, 1 Day
|
26 Weeks, 1 Day
|
Samacsys Manufacturer |
Renesas Electronics
|
Renesas Electronics
|
Adjustable Threshold |
NO
|
NO
|
Analog IC - Other Type |
INTEGRATED POWER MANAGEMENT UNIT
|
INTEGRATED POWER MANAGEMENT UNIT
|
JESD-30 Code |
S-PQCC-N16
|
S-PQCC-N16
|
JESD-609 Code |
e3
|
e3
|
Length |
4 mm
|
4 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of Channels |
4
|
4
|
Number of Functions |
1
|
1
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVQCCN
|
HVQCCN
|
Package Equivalence Code |
LCC16,.16SQ,25
|
LCC16,.16SQ,25
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Seated Height-Max |
0.75 mm
|
0.75 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
2.5 V
|
2.5 V
|
Supply Voltage-Nom (Vsup) |
3.6 V
|
3.6 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
Matte Tin (Sn) - annealed
|
Matte Tin (Sn) - annealed
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.65 mm
|
0.65 mm
|
Terminal Position |
QUAD
|
QUAD
|
Threshold Voltage-Nom |
1.41
|
1.41
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
4 mm
|
4 mm
|
Base Number Matches |
1
|
2
|
|
|
|
Compare ISL9307IRTAANLZ-T7A with alternatives
Compare ISL9307IRTAAJGZ-T with alternatives