ISL9305IRTHWCNLZ-T
vs
ISL9305IRTWLNCZ-T
feature comparison
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
INTERSIL CORP
|
INTERSIL CORP
|
Part Package Code |
TQFN
|
TQFN
|
Package Description |
HVQCCN, LCC16,.16SQ,25
|
HVQCCN, LCC16,.16SQ,25
|
Pin Count |
16
|
16
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
26 Weeks
|
26 Weeks
|
Adjustable Threshold |
YES
|
YES
|
Analog IC - Other Type |
POWER SUPPLY SUPPORT CIRCUIT
|
POWER SUPPLY SUPPORT CIRCUIT
|
JESD-30 Code |
S-PQCC-N16
|
S-PQCC-N16
|
JESD-609 Code |
e3
|
e3
|
Length |
4 mm
|
4 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of Channels |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVQCCN
|
HVQCCN
|
Package Equivalence Code |
LCC16,.16SQ,25
|
LCC16,.16SQ,25
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
0.8 mm
|
0.8 mm
|
Supply Current-Max (Isup) |
7.5 mA
|
7.5 mA
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
2.5 V
|
2.3 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
MATTE TIN
|
MATTE TIN
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.65 mm
|
0.65 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
4 mm
|
4 mm
|
Base Number Matches |
2
|
2
|
|
|
|
Compare ISL9305IRTHWCNLZ-T with alternatives
Compare ISL9305IRTWLNCZ-T with alternatives