ISL84515IBZ
vs
ISL84515IHZ-T
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
INTERSIL CORP
|
INTERSIL CORP
|
| Part Package Code |
SOIC, SOT
|
SOT
|
| Package Description |
SOP, SOP8,.25
|
LSSOP, TSOP5/6,.11,37
|
| Pin Count |
8, 5
|
5
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
SPST
|
SPST
|
| JESD-30 Code |
R-PDSO-G8
|
R-PDSO-G5
|
| JESD-609 Code |
e3
|
e3
|
| Length |
4.9 mm
|
2.9 mm
|
| Moisture Sensitivity Level |
1
|
3
|
| Normal Position |
NC
|
NC
|
| Number of Channels |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
5
|
| On-state Resistance-Max (Ron) |
50 Ω
|
50 Ω
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
LSSOP
|
| Package Equivalence Code |
SOP8,.25
|
TSOP5/6,.11,37
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.75 mm
|
1.45 mm
|
| Supply Voltage-Max (Vsup) |
12 V
|
12 V
|
| Supply Voltage-Min (Vsup) |
2.4 V
|
2.4 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Switch-off Time-Max |
100 ns
|
100 ns
|
| Switch-on Time-Max |
150 ns
|
150 ns
|
| Switching |
BREAK-BEFORE-MAKE
|
BREAK-BEFORE-MAKE
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Matte Tin (Sn) - annealed
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.95 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
3.9 mm
|
1.6 mm
|
| Base Number Matches |
2
|
2
|
| Factory Lead Time |
|
26 Weeks
|
|
|
|
Compare ISL84515IBZ with alternatives
Compare ISL84515IHZ-T with alternatives