ISL6506BCBZA
vs
ISL6506BCBZ
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
INTERSIL CORP
|
Part Package Code |
SOICN-EP
|
SOIC
|
Package Description |
SOIC-8
|
HLSOP, SOP8,.25
|
Pin Count |
8
|
8
|
Manufacturer Package Code |
M8.15C
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Date Of Intro |
2017-11-13
|
|
Samacsys Manufacturer |
Renesas Electronics
|
|
Adjustable Threshold |
NO
|
NO
|
Analog IC - Other Type |
ACPI COMPLIANT LINEAR POWER CONTROLLER
|
ACPI COMPLIANT LINEAR POWER CONTROLLER
|
JESD-30 Code |
R-PDSO-G8
|
R-PDSO-G8
|
JESD-609 Code |
e3
|
e3
|
Length |
4.89 mm
|
4.89 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of Channels |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
8
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HLSOP
|
HLSOP
|
Package Equivalence Code |
SOP8,.25
|
SOP8,.25
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE
|
SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Seated Height-Max |
1.68 mm
|
1.68 mm
|
Supply Voltage-Max (Vsup) |
5.25 V
|
5.25 V
|
Supply Voltage-Min (Vsup) |
4.75 V
|
4.75 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
Matte Tin (Sn) - annealed
|
Matte Tin (Sn) - annealed
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
3.9 mm
|
3.9 mm
|
Base Number Matches |
4
|
8
|
Factory Lead Time |
|
26 Weeks
|
Qualification Status |
|
Not Qualified
|
|
|
|
Compare ISL6506BCBZA with alternatives
Compare ISL6506BCBZ with alternatives