ISL6439IBZ-T
vs
ISL6527IR-T
feature comparison
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
INTERSIL CORP
|
ROCHESTER ELECTRONICS INC
|
| Part Package Code |
SOIC
|
QFN
|
| Package Description |
SOP, SOP14,.25
|
HVQCCN,
|
| Pin Count |
14
|
16
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Factory Lead Time |
26 Weeks
|
|
| Analog IC - Other Type |
SWITCHING CONTROLLER
|
SWITCHING CONTROLLER
|
| Control Mode |
VOLTAGE-MODE
|
VOLTAGE-MODE
|
| Control Technique |
PULSE WIDTH MODULATION
|
PULSE WIDTH MODULATION
|
| Input Voltage-Max |
3.465 V
|
3.63 V
|
| Input Voltage-Min |
3.135 V
|
2.97 V
|
| Input Voltage-Nom |
3.3 V
|
3.3 V
|
| JESD-30 Code |
R-PDSO-G14
|
S-PQCC-N16
|
| JESD-609 Code |
e3
|
e0
|
| Length |
8.65 mm
|
5 mm
|
| Moisture Sensitivity Level |
3
|
NOT SPECIFIED
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
14
|
16
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
HVQCCN
|
| Package Equivalence Code |
SOP14,.25
|
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
240
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.75 mm
|
1 mm
|
| Surface Mount |
YES
|
YES
|
| Switcher Configuration |
PUSH-PULL
|
PUSH-PULL
|
| Switching Frequency-Max |
340 kHz
|
340 kHz
|
| Technology |
MOS
|
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Matte Tin (Sn) - annealed
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
0.8 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
| Width |
3.9 mm
|
5 mm
|
| Base Number Matches |
2
|
2
|
| Pbfree Code |
|
No
|
| Rohs Code |
|
No
|
|
|
|
Compare ISL6439IBZ-T with alternatives
Compare ISL6527IR-T with alternatives