ISL6292-1CR3Z
vs
ISL6292-1CR3
feature comparison
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
INTERSIL CORP
|
RENESAS ELECTRONICS CORP
|
| Part Package Code |
DFN, QFN
|
|
| Package Description |
HVSON, SOLCC10,.11,20
|
DFN-10
|
| Pin Count |
10, 16
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
26 Weeks
|
|
| Adjustable Threshold |
NO
|
NO
|
| Analog IC - Other Type |
POWER SUPPLY SUPPORT CIRCUIT
|
POWER SUPPLY SUPPORT CIRCUIT
|
| JESD-30 Code |
S-PDSO-N10
|
S-PDSO-N10
|
| JESD-609 Code |
e3
|
|
| Length |
3 mm
|
3 mm
|
| Moisture Sensitivity Level |
3
|
|
| Number of Channels |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
10
|
10
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
-20 °C
|
-20 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVSON
|
HVSON
|
| Package Equivalence Code |
SOLCC10,.11,20
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1 mm
|
1 mm
|
| Supply Voltage-Max (Vsup) |
6.5 V
|
6.5 V
|
| Supply Voltage-Min (Vsup) |
4.3 V
|
4.3 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
| Width |
3 mm
|
3 mm
|
| Base Number Matches |
2
|
5
|
| Rohs Code |
|
No
|
| Date Of Intro |
|
2017-11-14
|
|
|
|
Compare ISL6292-1CR3Z with alternatives
Compare ISL6292-1CR3 with alternatives